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The manufacture of ultra-thin molybdenum copper heat sinks must not only maintain the compactness and uniformity of the alloy, but also meet the requirements of high dimensional accuracy, excellent surface quality and structural strength. Although the traditional powder metallurgy process is suitable for the mass production of medium-thick molybdenum-copper alloys, the main challenges in the manufacture of ultra-thin dimensions (e.g., thickness less than 0.3 mm) are as follows: 1. Difficult to press: Due to the high hardness of molybdenum powder…

Molybdenum-copper alloy is widely used in key components such as packaging heat sinks, substrates and heat sinks for high-power semiconductor devices. However, due to the complex surface chemistry and low surface activity of the alloy, it is prone to problems such as insufficient interfacial bonding, poor electrical contact performance, and unstable corrosion resistance when directly used in packaging applications. Therefore, electroplating and surface treatment processes have become a key link to improve their packaging performance. There are two main problems…

With the rapid development of semiconductor devices in the direction of high power, high frequency and high integration, the heat generated during the operation of chips is increasing, which puts forward higher requirements for the thermal management performance of packaging materials. Among many packaging materials, molybdenum-copper alloy (Mo-Cu alloy) has become an ideal candidate material for high-end power devices and semiconductor chip packaging due to its excellent thermal performance and thermal expansion matching. Mo-Cu alloy is a metal matrix composite…

Molybdenum-copper alloy (Mo-Cu) is a material composed of molybdenum with high melting point and high strength and high thermal conductivity and high electrical conductivity, which is commonly used in thermal management and structural packaging in high-end fields such as electronic devices, power modules, and aerospace. Due to its unique thermal and mechanical properties, the alloy occupies an important position in metal encapsulation materials. From the perspective of thermal conductivity and thermal expansion coefficient, Mo-Cu has a high thermal conductivity (generally…