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Molybdenum-copper alloy is usually formed by combining copper and molybdenum through sintering, hot pressing and other processes. Molybdenum has an extremely high melting point and a low coefficient of thermal expansion, while copper has excellent thermal conductivity, which allows the combination of the two to effectively dissipate heat in high-temperature environments without cracking or failing due to differences in thermal expansion. Therefore, molybdenum-copper heat sink materials are widely used in fields that require high thermal conductivity and thermal stability, such…

Powder metallurgy (PM) and liquid phase sintering (LPS) are two common process methods in the preparation of molybdenum-copper alloys. Although both can be used to produce molybdenum copper, there are obvious differences in terms of process, material properties, cost and application fields. 1. Material density and structural uniformity The powder metallurgy process mainly relies on solid-phase sintering, due to the limited shrinkage of the material in the sintering process, the density of the final product is usually low, and it…

Molybdenum-copper heat sink material has become an important part of high-power electronic devices due to its excellent thermal conductivity and high temperature resistance. Through precise manufacturing processes, such as powder mixing, sintering, hot pressing, etc., the comprehensive properties of molybdenum-copper composites can be effectively improved. However, each step in the manufacturing process has a significant impact on the performance of the final material, so the process needs to be optimized according to the needs of different applications to ensure the…

Molybdenum-copper alloy has a wide range of application prospects in the field of high-power electronic packaging due to their high thermal conductivity and adjustable coefficient of thermal expansion. By optimizing the composition ratio, manufacturing process, and microstructure, better thermal conductivity and more precise thermal expansion matching can be achieved, providing a more reliable heat dissipation solution for electronic devices. Research focus on the matching of thermal conductivity and thermal expansion The core advantage of molybdenum-copper alloy in electronic packaging lies…

The coefficient of thermal expansion of molybdenum-copper alloys can be optimized to match different packaging requirements by adjusting the ratio of molybdenum-copper. The manufacturing process has a significant impact on the uniformity and stability of the CTE, and precise control of the CTE can help improve the reliability of electronic packaging. With the development of advanced packaging technology, molybdenum copper will play a more important role in high heat load electronic devices. The coefficient of thermal expansion (CTE) represents the…

The thermal conductivity of molybdenum-copper alloy increases with the increase of copper content, but it is necessary to comprehensively consider factors such as thermal expansion coefficient and mechanical strength to meet the needs of different application scenarios. Optimization of manufacturing processes, such as liquid-phase sintering and HIP processing, can help improve the thermal conductivity of materials, allowing them to play a greater role in high-power electronic packaging and thermal management. Thermal conductivity is a key parameter that measures the ability…

Molybdenum-copper alloy plays an important role in electronic packaging, and is widely used in high-power and high-reliability electronic devices due to its excellent thermal management ability, matching thermal expansion coefficient, good mechanical strength and high temperature resistance. With the progress of semiconductor technology, the requirements for packaging materials are getting higher and higher, and molybdenum copper will still be one of the important materials in this field and will play a greater role in packaging technology in the future. Its…

In the modern electronics industry, thermal management of high-power and high-frequency electronics is a key challenge. With the continuous development of power semiconductors, RF devices and optoelectronic products, the choice of materials plays a crucial role in the reliability and heat dissipation performance of the package. Molybdenum-copper alloy (Mo-Cu) has become one of the important materials in the field of electronic packaging due to its excellent thermal conductivity, low coefficient of thermal expansion (CTE) and good mechanical strength. Molybdenum copper…